Mold-Tek Packaging informs about outcome of board meeting
Mold-Tek Packaging has informed that the Board of Directors (Board) of the Company at its meeting held today i.e. April 20, 2026, has, considered and approved the First Interim Dividend of ₹ 2 ( 40 %) per equity share of face value of ₹ 5/- each for the Financial Year 2025-26. Further, as per our letter dated April 15, 2026, the Record Date for the purpose of ascertaining the eligibility of members for payment of interim dividend shall be Friday, April 24, 2026 and the interim dividend shall be duly paid within the stipulated timelines as prescribed under law. The Board meeting commenced at 11:00 A.M. (IST) and concluded at 11:35 AM (IST).
The above information is a part of company’s filings submitted to BSE.
